Mastering Heat Sealing: Optimizing Procedures and Parameters for Plastic Assembly

In the realm of plastic assembly, particularly in the domains of anisotropic and formono-isotropic liquid crystal display (LCD) assembly, heat seal connectors (HSCs) to printed circuit boards (PCBs), and front panel displays, Thermal Press International (TPI) leads the way with its precision equipment designed to apply exacting temperature and pressure.  Our method for bonding connectors […]