This video demonstrates a tooling changeover on the Thermal Press International (TPI) MicroLAB Thermal Press system, highlighting the platform’s flexibility for precision thermal assembly applications requiring repeatable setup precedures and process control.
The MicroLAB system is designed for compact and miniature assembly applications commonly found in medical device manufacturing, microfluidics, electronics assembly, diagnostic devices, wearable technologies, and other precision manufacturing environments. The system supports flexible tooling configurations that help streamline setup changes while maintaining consistent positioning, alignment, and thermal process repeatability.
In this example, the tooling is being changed over between foil sealing applications involving two different sizes of plastic vials. Applications such as these often require precise alignment, repeatable temperature control, and consistent sealing pressure to maintain reliable seal quality across varying component geometries.
Because the tooling changeover is performed shortly after a production cycle, a heat-resistant glove is used while handling the thermal compenents.
TPI systems can be configured for heat staking, heat sealing, thermal insertion, swaging, and other thermal plastic assembly applications using custom tooling, servo or pneumatic actuation, rotary indexing configuration, shuttle tables, and advanced motion control systems.
The compact footprint and cleanroom-friendly design make the MicroLAB platform especially well suited for laboratory, R&D, pilot production, and low-to-medium volume manufacturing environments requiring precision thermal assembly solutions.
